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  september 2011 doc id 022220 rev 1 1/7 7 SMM4F12AVCL 400 w low clamping voltage transil? features typical peak pulse power: ? 400 w (10/1000 s) ? 2.4 kw (8/20 s) stand off voltage: 12 v unidirectional type low clamping factor low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c operating t j max: 175 c high power capability at 85 c: 385 w jedec registered package outline rohs package halogen free molding compound complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g-method 3015-7: class3 ? 25 kv (human body model) description the SMM4F12AVCL transil series has been designed to protect sensitive equipment against electro-static discharges according to iec 61000- 4-2, mil std 883 method 3015, and electrical over stress such as iec 61000-4-4 and 5. they are generally for surges below 400 w 10/1000 s. this planar technology ma kes it compatible with high-end equipment and smps where low leakage current and high junction temperature are required to provide reli ability and stability over time. their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy such as hdd power combo voltage regulators. packaged in stmite flat, this minimizes pcb space consumption (footprint in accordance with ipc 7531 standard). tm: transil is a trademark of stmicroelectronics k a stmite flat (do222-aa) www.st.com
characteristics SMM4F12AVCL 2/7 doc id 022220 rev 1 1 characteristics figure 1. electrical characteri stics - parameter definitions figure 2. definition of i pp pulse table 1. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (iec 61000-4-2 contact discharge) 30 kv p pp peak pulse power dissipation (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. t j initial = t amb 400 w p power dissipation on infinite heatsink t amb = 125 c 2.5 w t stg storage temperature range -65 to +175 c t j operating junction temperature range -55 to +175 c t l maximum lead temperature for soldering during 10 s 260 c table 2. thermal resistances symbol parameter value unit r th(j-l) junction to leads 20 c/w r th(j-a) junction to ambient on pcb with recommended pad layout 250 v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f unidirectional symbol parameter v stand-off voltage v breakdown voltage v clamping voltage i leakage current @ v i peak pulse current t voltage temperature coefficient v forward voltage drop r dynamic resistance rm br cl rm rm pp f d a pulse waveform x/y s t p = x s y s %i 100 50 0 t
SMM4F12AVCL characteristics doc id 022220 rev 1 3/7 figure 5. clamping voltage versus peak pul se current (exponential waveform, maximum values) table 3. electrical characteristics - parameter values (t amb = 25 c) (1) type i rm max@v rm v br @i r (2) v cl @i pp 10/1000 s r d (3) 10/1000 s v cl @i pp 8/20 s r d (3) 8/20 s t (4) 25 c 85 c min typ max max max max a v v ma v a va 10-4/c SMM4F12AVCL 0.2 1 12 13 13.5 14 1 14.3 1 0.3 22.9 100 0.09 8.3 1. surge capability given for both directions 2. pulse test: t p <50ms. 3. to calculate maximum clamping voltage at othe r surge currents, use the following formula v clmax = r d x i pp + v brmax 4. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25 c x (1 + t x (t j - 25)) figure 3. peak power dissipation versus initial junction temperature figure 4. peak pulse power versus exponential pulse duration (t j initial = 25 c) p pp [t j initial] / p p p [t j init ial =25 c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 25 50 75 100 125 150 175 200 10/1000 s t (c) j initial p (kw) pp 0.1 1.0 10.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 t j initial = 25 c t (ms) p i pp (a) 0.1 1.0 10.0 100.0 1000.0 12 14 16 18 20 22 24 t j initial=25 c tp = 8/20us s tp = 10/1000 s v cl (v)
ordering information scheme SMM4F12AVCL 4/7 doc id 022220 rev 1 2 ordering information scheme figure 8. ordering information scheme figure 6. relative variation of thermal impedance junction to ambient versus pulse duration figure 7. thermal resistance junction to ambient versus copper surface under each lead 0.00 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 z th(j-a) /r th(j-a) t (s) p on recommended pad layout printed circuit board fr4 copper thickness = 35 m 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 r th(j-a) (c/w) s (cm ) cu 2 printed circuit board fr4 copper thickness = 35 m sm m 4f 12 a vcl surface mount package surge rating m = stmite package 4f = 400 w in flat package stand off voltage example - 12 = 12 v type a = unidirectional low clamping voltage
SMM4F12AVCL package information doc id 022220 rev 1 5/7 3 package information case: jedec do-222aa molded plastic over planar junction terminals: solder plated, solderable per mil-std-750, method 2026 polarity: the band indicates cathode. flammability: epoxy meets ul94v-0 rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 4. stmite flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 d 1.75 1.90 2.05 0.069 0.075 0.081 e 3.60 3.80 3.90 0.142 0.150 0.154 e1 2.80 2.95 3.10 0.110 0.116 0.122 l 0.50 0.55 0.80 0.020 0.022 0.031 l1 2.10 2.40 2.60 0.083 0.094 0.102 l2 0.45 0.60 0.75 0.018 0.024 0.030 l3 0.20 0.35 0.50 0.008 0.014 0.020 figure 9. stmite flat footprint dimensions figure 10. marking information e1 e c d b l3 a l l1 l2 b2 0.85 0.63 2.00 millimeters (inches) 4.13 0.95 1.95 0.65 0.65 (0.033) (0.079) (0.037) (0.077) (0.026) (0.163) (.025) (.026) y w w x x x xxx: marking y: year ww: week cathode bar
ordering information SMM4F12AVCL 6/7 doc id 022220 rev 1 4 ordering information 5 revision history table 5. ordering information order code marking package weight base qty delivery mode SMM4F12AVCL 4ul stmite flat 16.7 mg 12000 tape and reel table 6. document revision history date revision changes 13-sep-2011 1 first issue.
SMM4F12AVCL doc id 022220 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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